Defects and dislocation densities in InP wafers
Indium Phosphide wafers are frequently used as substrates for the growth of infrared laser and LED heterostructures. Wafers are commercially available and may easily be obtained in large quantity for production. Defects in substrates are generally specified as a dislocation density, but the inhomogeneity of their distribution and the range of sizes is not known from one wafer to the next. When growing a new device on such a wafer, it is imperative to understand how the substrate defects affect the heterojunctions above them that comprise the active layers of the device. At a minimum, the quality of the wafers should be measurable in order to determine whether they are of sufficient quality to be used in the production of reliable devices with near-zero latent defects.
Klar’s spectroscopic mapping system is ideally suited for capturing the variation of the bandgap across a wafer and identifying the size, distribution, and nature of any defects.
To demonstrate the use of the Klar instrument for such studies, we acquired a square 10mm commercial (100) InP wafer from MSE supplies and scanned a portion of it to map out the bandgap variation. Using ImageJ, we were able to determine that the defect density in our sample was within a factor of two of that specified by the supplier (~ 50,000/sq.cm.). This tool also captures the distribution of sizes of the defects.